International Scientific Committee
Bijan Adl-Zarrabi, Chalmers University of Technology, Sweden
Ahu Aydogan, City College of New York, United States
Rachel Becker, Technion Israel Institute of Technology, Israel
Umberto Berardi, Ryerson University, Canada
Mark Bomberg, International Journal of Building Physics, Canada
Courtney Crosson, University of Arizona, United States
Dana Cupkova,Carnegie Mellon, United States
Martina Decker, New Jersey Institute of Technology, United States
Timur Dogan, Cornell University, United States
Anna Dyson, Yale University, United States
Jack Esformes, Carrier Corporation, United States
David Fannon, Northeastern University, United States
Chenfei Gao, AT&T Labs, United States
Micheael Genovese, NYSERDA, United States
Jennifer Gerbi, U.S. Department of Energy, United States
Francesco Goia, Norwegian University of Science and Technology, Norway
John Grunewald, Dresden University of Technology, Germany
Linke Guo, Binghamton University, United States
Arild Gustavsen, Norwegian University of Science and Technology Trondheim, Norway
Carl-Eric Hagentoft, Chalmers University of Technology, Sweden
Fariborz Haghighat, Concordia University, Canada
Shuichi Hokoi, Kyoto University, Japan
Sture Holmberg, Stockholm KTH Royal Institute of Technology, Sweden
Tianzhen Hong, LBNL Berkeley, United States
Roger Hubeli, Syracuse University, United States
Aletheia Ida, University of Arizona, United States
Hong Im, King Abdullah University of Science and Technology, Saudi Arabia
Hans Janssen, KU Leuven, Belgium
Arnold Janssens, Ghent University, Belgium
James Jones, Virginia Polytechnic Institute, United States
Phil Jones, Cardiff University, United Kingdom
Alstan Jakubiec, Singapore University of Technology, Singapore
Mohammad Arif Kamal, Aligarh Muslim University, India
Shinsuke Kato, University of Tokyo, Japan
Essam Khalil, Cairo University, Egypt
Kwang-Woo Kim, Seoul National University, South Korea
Tham Kwok Wai, National University of Singapore, Singapore
Kyle Konis, University of Southern California, United States
Yuguo Li, University of Hong Kong, China
John Little, Virginia Polytechnic Institute, United States
Shichao Liu, Worcester Polytechnic Institute, United States
Vivian Loftness, Carnegie Mellon, United States
Mae-Ling Lokko, Rensselaer Polytechnic Institute, United States
Dick Lord, Carrier Corporation, United States
Sinead Mac Namara, Syracuse University, United States
Kaoru Maruta, Tohoku University, Japan
Berardo Matalucci, SHoP Architects, United States
Forrest Meggers, Princeton University, United States
Arsen Melikov, Danish Technical University, Denmark
Chilukuri Mohan, Syracuse University, United States
Franco Montalto, Drexel University, United States
Chris Muller, Purafil, United States
Peter V. Nielsen, Aalborg University, Denmark
Vahid Nik, Lund University, Sweden
Les Norford, Massachusetts Institute of Technology, United States
Nick Novelli, HeliOptix LLC/Yale University, United States
Zoltan Nagy, The University of Texas at Austin, United States
Liam O’Brien, Carlton University of Ottawa Canada, Canada
Ryozo Ooka, University of Tokyo, Japan
Mauro Overend, University of Cambridge, United Kingdom
Ulrike Passe, Iowa State, United States
Marco Perino, Politecnico di Torino, Italy
Pat Phelan, Arizona State University, United States
Ute Poerschke, Pennsylvania State University, United States
Menghao Qin, Technical University of Denmark, Denmark
Reinhard Radermacher, Univeristy of Maryland, United States
Birgit Rasmussen, Aalborg University Copenhagen (AAU-CPH), Denmark
Carsten Rode, Technical University of Denmark, Denmark
Paul Ronney, University of South Carolina, United States
David Sailor, Arizona State University, United States
Mats Santamouris, University of Athens, Greece
Suresh Santanam, Syracuse University, United States
Usha Satish, Upstate Medical University, United States
Karma Sawyer, U.S. Department of Energy, United States
Henk Schellen, Eindhoven University of Technology, Netherlands
Stefano Schiavon, University of California Berkeley, United States
Chandra Sekhar, National University of Singapore, Singapore
Nina Sharifi, Ambis Technologies, United States
Lu Su, University of Buffalo, United States
Jeff Siegel, University of Toronto, Canada
Carey Simonson, University of Saskatchewan, Canada
Wil Srubar, University of Colorado Boulder, United States
Lu Su, University of Buffalo, United States
Fitsum Tariku, British Columbia Institute of Technology, Canada
Jorn Toftum, Danish Technical University, Denmark
Paolo Tronville, Politecnico di Torino, Italy
Carmen Trudell, California Polytechnic State, United States
Keith Van de Riet, University of Kansas, United States
Nora Wang, Pacific Northwest National Lab, United States
Yanzhi Wang, Syracuse University, United States
Hiroshi Yoshino, Tohoku University, Japan
Andrzej Zarzycki, New Jersey Institute of Technology, United States
John Zhai, University of Colorado Boulder, United States
Hui Zhang, University of California, Berkeley
Yinping Zhang, Tsinghua University, China
Jiping Zhu, Health Canada, Canada