International Scientific Committee

 

Bijan Adl-Zarrabi, Chalmers University of Technology, Sweden

Ahu Aydogan, City College of New York, United States

Rachel Becker, Technion Israel Institute of Technology, Israel

Umberto Berardi, Ryerson University, Canada

Mark Bomberg, International Journal of Building Physics, Canada

Courtney Crosson, University of Arizona, United States

Dana Cupkova,Carnegie Mellon, United States

Martina Decker, New Jersey Institute of Technology, United States

Timur Dogan, Cornell University, United States

Anna Dyson, Yale University, United States

Jack Esformes, Carrier Corporation, United States

David FannonNortheastern University, United States

Chenfei Gao, AT&T Labs, United States

Micheael GenoveseNYSERDA, United States

Jennifer Gerbi, U.S. Department of Energy, United States

Francesco Goia, Norwegian University of Science and Technology, Norway

John Grunewald, Dresden University of Technology, Germany

Linke Guo, Binghamton University, United States

Arild Gustavsen, Norwegian University of Science and Technology Trondheim, Norway

Carl-Eric Hagentoft, Chalmers University of Technology, Sweden

Fariborz Haghighat, Concordia University, Canada

Shuichi Hokoi, Kyoto University, Japan

Sture Holmberg, Stockholm KTH Royal Institute of Technology, Sweden

Tianzhen Hong, LBNL Berkeley, United States

Roger Hubeli, Syracuse University, United States 

Aletheia Ida, University of Arizona, United States

Hong Im, King Abdullah University of Science and Technology, Saudi Arabia

Hans Janssen, KU Leuven, Belgium

Arnold Janssens, Ghent University, Belgium

James Jones, Virginia Polytechnic Institute, United States

Phil Jones, Cardiff University, United Kingdom 

Alstan Jakubiec, Singapore University of Technology, Singapore

Mohammad Arif Kamal, Aligarh Muslim University, India

Shinsuke Kato, University of Tokyo, Japan

Essam Khalil, Cairo University, Egypt

Kwang-Woo Kim, Seoul National University, South Korea

Tham Kwok Wai, National University of Singapore, Singapore

Kyle Konis, University of Southern California, United States

Yuguo Li, University of Hong Kong, China

John Little, Virginia Polytechnic Institute, United States

Shichao Liu, Worcester Polytechnic Institute, United States

Vivian Loftness, Carnegie Mellon, United States

Mae-Ling Lokko, Rensselaer Polytechnic Institute, United States

Dick Lord, Carrier Corporation, United States

Sinead Mac Namara, Syracuse University, United States

Kaoru Maruta, Tohoku University, Japan

Berardo Matalucci, SHoP Architects, United States

Forrest Meggers, Princeton University, United States

Arsen Melikov, Danish Technical University, Denmark

Chilukuri Mohan, Syracuse University, United States

Franco Montalto, Drexel University, United States

Chris Muller, Purafil, United States

Peter V. Nielsen, Aalborg University, Denmark

Vahid Nik, Lund University, Sweden

Les Norford, Massachusetts Institute of Technology, United States

Nick Novelli, HeliOptix LLC/Yale University, United States

Zoltan Nagy, The University of Texas at Austin, United States

Liam O’Brien, Carlton University of Ottawa Canada, Canada

Ryozo Ooka, University of Tokyo, Japan

Mauro Overend, University of Cambridge, United Kingdom

Ulrike Passe, Iowa State, United States

Marco Perino, Politecnico di Torino, Italy

Pat Phelan, Arizona State University, United States

Ute Poerschke, Pennsylvania State University, United States

Menghao Qin, Technical University of Denmark, Denmark

Reinhard Radermacher, Univeristy of Maryland, United States

Birgit Rasmussen, Aalborg University Copenhagen (AAU-CPH), Denmark

Carsten Rode, Technical University of Denmark, Denmark

Paul Ronney, University of South Carolina, United States

David Sailor, Arizona State University, United States

Mats Santamouris, University of Athens, Greece

Suresh Santanam, Syracuse University, United States

Usha Satish, Upstate Medical University, United States

Karma Sawyer, U.S. Department of Energy, United States

Henk Schellen, Eindhoven University of Technology, Netherlands

Stefano Schiavon, University of California Berkeley, United States

Chandra Sekhar, National University of Singapore, Singapore

Nina Sharifi, Ambis Technologies, United States

Lu Su, University of Buffalo, United States

Jeff Siegel, University of Toronto, Canada

Carey Simonson, University of Saskatchewan, Canada

Wil Srubar, University of Colorado Boulder, United States 

Lu Su, University of Buffalo, United States

Fitsum Tariku, British Columbia Institute of Technology, Canada

Jorn Toftum, Danish Technical University, Denmark

Paolo Tronville, Politecnico di Torino, Italy

Carmen Trudell, California Polytechnic State, United States

Keith Van de Riet, University of Kansas, United States

Nora Wang, Pacific Northwest National Lab, United States

Yanzhi Wang, Syracuse University, United States

Hiroshi Yoshino, Tohoku University, Japan

Andrzej Zarzycki, New Jersey Institute of Technology, United States

John Zhai, University of Colorado Boulder, United States

Hui Zhang, University of California, Berkeley

Yinping Zhang, Tsinghua University, China

Jiping Zhu, Health Canada, Canada

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