International Scientific Committee

Bijan Adl-Zarrabi, Chalmers University of Technology, Sweden

Jakubiec Alstan, Singapore University of Technology, Singapore 

Ahu Aydogan Akseli, City College of New York, United States

Rachel Becker, Technion Israel Institute of Technology, Israel

Umberto Berard, Ryerson University, Canada

Mark Bomberg, International Journal of Building Physics, Canada

Qingyan Chen, Purdue University, United States

Dana Cupcova, Carnegie Mellon, United States

Martina Decker, New Jersey Institute of Technology, United States

Anna Dyson, CASE/Rensselaer Polytechnic Institute, United States

John Grunewald, Dresden University of Technology, Germany

Arild Gustavsen, Norwegian University of Science and Technology Trondheim, Norway

Carl-Eric Hagentoft, Chalmers University of Technology, Sweden

Fariborz Haghighat, Concordia University, Canada

Shuichi Hokoi, Kyoto University, Japan

Sture Holmberg, Stockholm KTH Royal Institute of Technology, Sweden

Tianzhen Hong, LBNL Berkeley, United States

Roger Hubeli, Syracuse University, United States

Arnold Janssens, Ghent University, Belgium

Phil Jones, Cardiff University, Wales

Karel Kabele, CSC Czech Technical University in Prague, Czech Republic

Shinsuke Kato, University of Tokyo, Japan

Essam Khalil, Cairo University, Egypt

Kwang-Woo Kim, Seoul National University, South Korea

Tham Kwok Wai, National University of Singapore, Singapore

Norford Les, Massachusetts Institute of Technology, United States

Yuguo Li, University of Hong Kong, China

John Little, Virginia Tech, United States

Mae-Ling Lokko, Rensselaer Polytechnic Institute/CASE/NEXUS, United States

Forrest Meggers, Princeton University, United States

Chris Muller, Purafil, United States

Peter V. Nielsen, Aalborg University, Denmark

Nick Novelli, HeliOptix LLC, United States

Ryozo Ooka, University of Tokyo, Japan

Ulrike Passe, Iowa State, United States

Marco Perino, Politecnico di Torino, Italy

Ute Poerschke, Pennsylvania State University, United States

Menghao Qin, Nanjing University, China

Reinhard Radermacher, Univeristy of Maryland, United States

Christoph Reinhart, Massachusetts Institute of Technology, United States

Carsten Rode, Technical University of Denmark, Denmark

Mats Santamouris, University of Athens, Greece

Henk Schellen, Eindhoven University of Technology, Netherlands

Stefano Schiavon, UCBerkeley, United States

Chandra Sekhar, National University of Singapore, Singapore

Jeff Siegel, University of Toronto, Canada

Carey Simonson, University of Saskatchewan, Canada

Shane Smith, University of Arizona, United States

Fitsum Tariku, British Columbia Institute of Technology, Canada

Dogan Timur, Cornell University, United States

Paolo Tronville, Politecnico di Torino, Italy

Carmen Trudell, California Polytechnic State, United States

Keith Van de Riet, University of Kansas, United States

Loftness Vivian, Carnegie Mellon, United States

Nina Wilson, Rensselaer Polytechnic Institute/CASE, United States

Hiroshi Yoshino, Tohoku University, Japan

Andrzej Zarzycki, New Jersey Institute of Technology, United States

John Zhai, University of Colorado Boulder, United States

Yinping Zhang, Tsinghua University, China

Jiping Zhu, Health Canada, Canada